Precision Fabrication · Advanced Integration
From sub-nanometer lithography to full-scale system integration — we manufacture the silicon intelligence behind tomorrow's technology.
What We Do
Elects operates across the full semiconductor value chain — from raw silicon ingot to packaged IC. Our integrated fabs in Miyagi deliver unmatched precision at scale.
300mm wafer processing with sub-3nm lithography. EUV patterning, CMP, ALD, and ion implantation under ISO Class 1 clean room standards.
Process design kit (PDK) delivery, DRC/LVS verification, and DFM analysis. Tailored to 5nm, 7nm, and 28nm CMOS process libraries.
Flip-chip BGA, 2.5D/3D-IC interposer integration, wafer-level packaging (WLP), and fan-out packaging for high-bandwidth applications.
Automated wafer probe, electrical characterisation, SEM/TEM inspection, and final component burn-in and reliability screening at volume.
SiC and GaN power device fabrication for EV drivetrains, renewable inverters, and industrial power conversion from 600V to 10kV rating.
III-V compound semiconductor (GaAs, InP) fab for RF/mmWave components, optical transceivers, and silicon photonics integration up to 400Gbps.
How We Build
Every chip that leaves Elects passes through a rigorously controlled fabrication sequence — optimised over 28 years of operational data.
Czochralski-grown 300mm boules are precision-sliced, lapped, etched, and polished to Ra < 0.1nm surface finish.
EUV and DUV immersion scanners define sub-5nm features across multi-patterning process flows.
ALD/CVD/PVD film stacks and atomic-layer etch (ALE) provide angstrom-level process control for gate, metal, and dielectric layers.
Ion implantation at energies from 2keV to 5MeV, followed by millisecond laser anneal to activate dopants without diffusion.
Inline SEM, OCD scatterometry, and e-beam inspection ensure zero-defect progression between every layer.
Wafer-level back-end processing, dicing, and automated probe-sort — finished devices shipped to JEDEC-compliant trays.
Product Lines
High-performance compute accelerator fabric for AI inference and HPC workloads.
Ultra-low-power SoC for edge AI, IoT, and next-generation mobile platforms.
25.6 Tbps programmable Ethernet switch for hyperscale data center fabric.
AEC-Q100 Grade 2 rated vision processor for Level 3–5 autonomous driving perception pipelines.
Get In Touch
Visit our headquarters and fab complex in Okayama, Miyagi Prefecture. Our engineering team is available for site tours, qualification discussions, and foundry partnerships.
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